Chip Scale Packaging

Views Updated: Dec 15, 2025

Key Facts

Abbreviation
CSP
Pronunciation
/ʧɪp skeɪl ˈpækɪʤɪŋ/
Category
Computing
Related Field
Hardware

Examples in Context

  1. Wafer chip scale packaging ( WCSP ) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.
  2. Chip scale packaging continues to draw attention for applications that require high performance or small form factor solutions.
  3. Design of MEMS Chip - Scale Atomic Clock and Hermetic Packaging of Cs / Rb Vapor
  4. Chip scale package ( CSP ) is a new microelectronic packaging technology rapidly deve - loped in recent years.
  5. Chip scale package ( CSP ) is a new microelectronic packaging technology rapidly developed in recent years Four types of CSP devices are described and fabrication technologies for each of them are analyzed in the paper

Other meanings of CSP

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