Die Bonding

Views Updated: Dec 15, 2025

Key Facts

Abbreviation
D/B
Pronunciation
/daɪ ˈbɑndɪŋ/
Category
Academic & Science
Related Field
Electronics

Examples in Context

  1. Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.
  2. Wafer chip scale packaging ( WCSP ) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.
  3. Compared with the prior art, the mechanical structure greatly enhances the efficiency of the die taking and the die bonding, and can obtain very high precision by setting appropriate parameters.
  4. Failure Mode of Die Bonding(D/B) and Improved Path of Bonding Strength
  5. In the measurement procedures of die bonding process, we apply infrared system to measure the thermal resistance and use bonding tester to estimate the die shear strength.

Other meanings of D/B

Deaf/Blind Community