Small Outline

Views Updated: Dec 15, 2025

Abbreviation

Pronunciation

/smɔl ˈaʊˌtlaɪn/

With the development of thin small outline electronic product, the technology of electronic packaging is more important gradually.
In this article, different combinations of finite element and calculating methods were used to investigate the best method for predicting the thin small outline packages ( TSOP ) warpage.
Tensile strength of the quad flat pack ( QFP ) devices were determined by STR-1000 Joint Strength Tester and compared with the joints soldered with different pitches and different solder compositions QFP and SOP ( small outline package ).
Then implement rapid component partition basing it. By means of the grayscale inertia moment theory, this system calculate chip rotation angle through the contour information of SOP ( Small Outline(SO) Package ) chips.
With the simple structure, small outline and friendly interface, this spectrometer is particularly suitable for the rapid determination of environment monitoring and food safety. 3.

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