Tape Automated Bonding

Views Updated: Dec 15, 2025

Key Facts

Abbreviation
TAB
Pronunciation
/teɪp ˈɔtəˌmeɪtɪd ˈbɑndɪŋ/
Category
Academic & Science
Related Field
Electronics

Examples in Context

  1. Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding.
  2. Tire recent advance on applications of laser processing in VLSI is presented with the emphasis on metal planarization, tape automated bonding, multiple layer metal electrods, multichip interconnection and mask or chip failure repair.
  3. Tape Automated Bonding(TAB) Technique
  4. TAB ( tape Automated bonding ) represents a new concept for IC assembly process. It can provide the advantage of small volume, low cost and high density.
  5. Bumped Tape Automated Bonding(TAB) ( BTAB ) Practical Application Guidelines

Other meanings of TAB